Retym

Semiconductor Leader Retym Secures $180M+ to Power AI Infrastructure Innovation

Business

Retym (pronounced “Re-Time”), an Israeli startup and cutting-edge semiconductor company, has officially emerged from stealth mode with over $180 million in total funding across multiple rounds. In its latest Series D funding round, led by Spark Capital, the company raised $75 million, further strengthening its position as a leader in AI infrastructure innovation.

Specializing in programmable coherent DSP (digital signal processing) solutions, Retym is transforming cloud and AI infrastructure by enabling faster, more efficient data transmission within and between AI data centers. The new investment will accelerate the company’s multi-generation product roadmap to meet the increasing demand for AI-driven network bandwidth.

With this funding milestone, James Kuklinski, General Partner at Spark Capital, joins Retym’s Board of Directors, bringing strategic expertise as the company scales its advanced semiconductor solutions for the AI era.

As the lines between “inside-the-datacenter” and “datacenter interconnect” become increasingly indistinct, Retym introduces its innovative, high-performance DSPs to address the burgeoning demands of modern AI infrastructure. Positioned to lead in power and performance, Retym’s solutions are crucial given Dell’Oro Group’s forecast of over $1 trillion in annual global spending on datacenter compute and networking within the next decade, where optical networking and DSPs are essential for unlocking AI’s capabilities. By meeting these complex demands, Retym aims to foster a thriving and competitive ecosystem.

With hyperscalers deploying AI across multiple locations and AI infrastructure requirements rapidly evolving, Retym is building the connectivity backbone for the future of AI.

“As AI infrastructure demands intensify, Retym is well-positioned to lead in delivering cost-effective and power-efficient DSP innovation for the rapidly evolving landscape,” said Sachin Gandhi, Retym’s co-founder and CEO. “We’re excited to collaborate with customers and ecosystem partners to integrate our DSPs into high-speed transceiver designs. With groundbreaking product announcements ahead, this is only the beginning.”